PAI 316P2 Rosin Flux
PAI 316P2 Rosin Flux is designed for both tin-lead & lead-free wave & dip soldering processes. It contains rosin, modified resin and organic activator to improve solder-ability.
Applying Method Dip, Wave methods.
Alloy Composition
| Item |
Typical Level |
| Amount of Flux Applied |
Foam: 500~1200 µg/in² of solids/in² |
| |
Spray: 350~830 µg/in² Solids |
| Topside Preheat Temperature |
85℃~130℃ (Best: 100℃~125℃) |
| Bottom side Preheat Temperature |
100℃~145℃(Best: 110℃~130℃) |
| Maximum Ramp Rate of Topside Temp. |
2℃/second maximum |
| Conveyor Speed |
0.7~1.5m/min. Best (0.7~1.1m/min) |
| Conveyor Angle |
4° ~8° (6° most common) |
| Dwell Time |
2~6sec |
| Solder Pot Temp. |
255℃~265℃(Sn/Ag3.0~4.0/Cu 0.5~0.9 Solder Bar) |
| |
265℃~280℃(Sn/Cu 0.7 Solder Bar) |
| |
250℃~260℃ (Sn/Pb37 Solder Bar) |
Technical Specification
| Item |
Result |
| Appearance |
Light Yellow Semi Liquid |
| Specific Gravity ，20℃ |
0.825 ± 0.010 |
| Acid Number, mg KOH/g |
19.0 ± 4.5 |
| Solids Content，， |
14.3 ± 0.3 |
Storage, Shelf Life Indication
Store in cool place and tighten the cap. Do not expose to sunlight or heat source. 12 Months from the Date of manufacturing.
Safety Indication
The flux must not be used near open flames or near non-flameproof electrical equipment. Please refer to the Material Safety Data Sheet as the primary source of health and safety information.
